PART |
Description |
Maker |
449-10-210 449-10-210-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
349-10-103-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
449-10-212 449-10-212-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
349-10-104-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
335-40-132-00-160000 |
Interconnect Header .100 Grid; Straight Pin Header .018 Pin Head with Solder Tail; Low Profile Single Row
|
Mill-Max Mfg. Corp.
|
0901210765 90121-0765 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0901200776 90120-0776 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
SD-70287-003 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
0901362202 90136-2202 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
829-22-019-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
829-22-011-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|